High Peak Output Current — 1. Short Delay Times — 40 ns typ. Matched Rise and Fall Times? Latch-Up Protected: Will Withstand 0.
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High Peak Output Current — 1. Short Delay Times — 40 ns typ. Matched Rise and Fall Times? Latch-Up Protected: Will Withstand 0. ESD Protected — 4 kV? Switch Mode Power Supplies? Line Drivers? These devices are highly latch-up resistant under any conditions within their power and voltage ratings.
They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to mA of reverse current of either polarity being forced back into their outputs. The TC has one inverting and one non-inverting driver.
Supply Voltage Note 3 MSOP These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. C with 4. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range e.
Rise and Fall Times vs. Propagation Delay Time vs. Input Amplitude. Supply 2. Supply Current vs. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4. Crossover Energy vs.
Description 3. These inputs also have mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. The ground pin s should have a low-impedance connection to the bias supply source return. High peak currents will flow out the ground pin s when the capacitive load is being discharged. The pull-down and pullup devices are of equal strength, making the rise and fall times equivalent.
The VDD input should be bypassed with local ceramic capacitors. The value of these capacitors should be chosen based on the capacitive load that is being driven.
A value of 1. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board, to aid in heat removal from the package.
TC4428 MICROCHIP [Microchip Technology], TC4428 Datasheet - Page 3
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