VP3082 DATASHEET PDF

With controlled transition times, these devices are suitable for transmitting data over long twisted-pair cables. These devices are designed to operate with very low supply current, typically 0. When in the inactive shutdown mode, the supply current drops to a few nanoamps, making these devices ideal for power-sensitive applications. These devices match the industry-standard footprint of SN Power-on reset circuits keep the outputs in a high impedance state until the supply voltage has stabilized. A thermal shutdown function protects the device from damage due to system fault conditions.

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With controlled transition times, these devices are suitable for transmitting data over long twisted-pair cables. These devices are designed to operate with very low supply current, typically 0. When in the inactive shutdown mode, the supply current drops to a few nanoamps, making these devices ideal for power-sensitive applications.

These devices match the industry-standard footprint of SN Power-on reset circuits keep the outputs in a high impedance state until the supply voltage has stabilized. A thermal shutdown function protects the device from damage due to system fault conditions. Add an R suffix to the device type i. The DGK package is available taped and reeled. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. See thermal characteristics table for information on maintenance of this specification for the DGK package. A 0.

Tested in accordance with IEC —4—4. Driver Short-Circuit Figure 8. Only when the differential input is more negative than VIT- will the receiver output transition to a Low state. Figure Note: Stub lengths off the main line should be kept as short as possible. Typical Application Circuit Copyright?

Power supply current is delivered to the bus load as well as to the transceiver circuitry. For a typical RS— bus configuration, the load that an active driver must drive consists of all of the receiving nodes, plus the termination resistors at each end of the bus. The load presented by the receiving nodes depends on the input impedance of the receiver. With up to 32 unit loads allowed on the bus, the total current supplied to all receivers can be as high as 32 mA. The current in the termination resistors depends on the differential bus voltage.

The standard requires active drivers to produce at least 1. See Figure Overall, the total load current can be 60 mA to a loaded RS bus. This is in addition to the current required by the transceiver itself; the HVDxE circuitry requires only about 0. In low-power shutdown mode, neither the driver nor receiver is active, and the supply current is low. Supply current increases with signaling rate primarily due to the totum pole outputs of the driver see Figure When these outputs change state, there is a moment when both the high-side and low-side output transistors are conducting and this creates a short spike in the supply current.

As the frequency of state changes increases, more power is used. If the enable inputs are in this state for less than 60 ns, the device does not enter shutdown mode. Only when the enable inputs are held in this state for ns or more, the device is assured to be in shutdown mode. In this low-power shutdown mode, most internal circuitry is powered down, and the supply current is typically 1 nA.

When either the driver or the receiver is re-enabled, the internal circuitry becomes active. If the D input is open when the driver is enabled, the driver outputs defaults to A high and B low, in accordance with the driver failsafe feature. If there is no valid state on the bus the receiver responds as described in the failsafe operation section. If both the receiver and driver are re-enabled simultaneously, the receiver output is driven according to the state of the bus inputs A and B and the driver output is driven according to the D input.

Note that the state of the active driver affects the inputs to the receiver. Therefore, the receiver outputs are valid as soon as the driver outputs are valid. Standardized testing includes specification of PCB construction, test chamber volume, sensor locations, and the thermal characteristics of holding fixtures.

The low-k board gives average in-use condition thermal performance and consists of a single trace layer 25 mm long and 2-oz thick copper. The high-k board gives best case in—use condition and consists of two 1—oz buried power planes with a single trace layer 25 mm long with 2-oz thick copper. It is measured by putting the mounted package up against a copper block cold plate to force heat to flow from die, through the mold compound into the copper block. It is NOT a useful characteristic to predict junction temperature as it provides pessimistic numbers if the case temperature is measured in a non-standard system and junction temperatures are backed out.

Thermal Resistance Copyright? NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.

TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All linear dimensions are in inches millimeters. This drawing is subject to change without notice.

Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.

Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design.

Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

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VP3082 DATASHEET EPUB DOWNLOAD

Grom For the latest package information, go to http: Supply current increases with signaling rate primarily vp datasheet to the totum pole outputs of the driver datssheet Figure Reproduction of information in TI data books or data sheets is permissible only if reproduction vp datasheet without. Test load capacitance includes probe and jig vp datasheet unless otherwise specified. The dafasheet in the termination resistors depends on the differential bus voltage. Driver vp datasheet receiver enabled. Samples may or may not be available. Device has been announced but is not in production. When either the driver or the receiver is re-enabled, the internal circuitry becomes active.

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